TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Ms yuan gao | TCDV | 2022-03 | 2026 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2019-07-17 | |||||
| PNW |
| 2019-07-19 | ||||
| PRVN | 2019-10-11 | 2019-10 | ||||
| ACD |
| 2019-12-20 | 2020-01 | |||
| CD |
| 2020-04-17 | 2020-01 | |||
| PCC | 2020-06-12 | 2020-06 | ||||
| ACDV |
| 2020-12-14 | 2021-03 | |||
| TCDV | 2020-12-15 | 2021-03 | ||||
| TCDV | 2020-12-15 | 2021-03 | ||||
| TCDV | 2021-01-25 | |||||
| CCDV | ||||||
300 kB
39 kBProject
IEC 61189-2-807 ED1
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA