TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Ms yuan gaoTCDV2022-032026

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2019-07-17 
PNW
91/1593/NP PDF file 300 kB
2019-07-19 
PRVN
2019-10-112019-10
ACD
91/1633/RVN Word file 39 kB
PDF file 207 kB
2019-12-202020-01
CD
91/1647/CD
PDF file 275 kB
2020-04-172020-01
PCC
2020-06-122020-06
ACDV
91/1695/CC PDF file 119 kB
Word file 160 kB
2020-12-142021-03
TCDV
2020-12-152021-03
TCDV
2020-12-152021-03
TCDV
2021-01-25 
CCDV
  


Project

IEC 61189-2-807 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA