TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Mr Ying GE | PRVC | 2021-10 | 2026 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2019-07-12 | |||||
| PNW |
| 2019-07-26 | ||||
| PRVN | 2019-10-18 | 2019-10 | ||||
| ACD |
| 2019-12-13 | 2020-01 | |||
| CD |
| 2019-12-20 | 2020-01 | |||
| PCC | 2020-03-13 | 2020-03 | ||||
| ACDV |
| 2020-07-17 | 2020-10 | |||
| TCDV | 2020-07-20 | 2020-09 | ||||
| CCDV |
| 2020-09-11 | 2020-09 | |||
| PRVC | 2020-12-04 | 2020-12 | ||||
| 2021-02 | ||||||
2468 kB
39 kBProject
IEC 61189-2-501 ED1
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials