International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 PPUB2016-092021

History

Stage
Document
Downloads
Decision Date
Target Date
CFDIS
91/1362/FDIS
2016-04-15 
APUB
91/1373/RVD PDF file 113 kB
2016-06-01 
DECPUB
2016-06-02 
RPUB
2016-07-25 
BPUB
2016-09-072016-06
PPUB
2016-11-082016-07
  

Abstract

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Project

IEC 63055:2016 ED1

Format for LSI-Package-Board Interoperable design

 

 

Associated Documents:

SMB/5815A/RV

PDF file 99 kB