International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 D.J. SOBERPPUB2013-102020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/758/NP PDF file 185 kB
2008-03-07 
ANW
91/791/RVN PDF file 183 kB
2008-08-012008-07
1CD
91/950/CD PDF file 250 kB
2010-09-242010-03
ACDV
91/966/CC Word file 122 kB
PDF file 215 kB
2011-02-182010-12
CCDV
91/972/CDV PDF file 253 kB
PDF file 273 kB
2011-04-082011-04
AFDIS
91/1009A/RVC Word file 125 kB
PDF file 107 kB
2011-09-152011-12
DECFDIS
2013-06-242013-04
RFDIS
2013-07-012013-07
CFDIS
91/1125/FDIS

2013-07-312013-09
APUB
91/1147/RVD PDF file 30 kB
2013-10-072013-10
BPUB
2013-10-082013-10
PPUB
2013-11-042013-11
  

Abstract

IEC 61249-4-18:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

Project

IEC 61249-4-18:2013 ED1

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

 

 

Associated Documents:

SMB/4881/DL

PDF file 348 kB