International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 Qiang YUPPUB2010-022023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/639/NP PDF file 390 kB
2006-10-20 
ANW
91/653/RVN PDF file 492 kB
2007-03-022007-03
1CD
91/707/CD PDF file 1196 kB
2007-07-272007-07
ACDV
91/765/CC PDF file 271 kB
2008-04-252007-12
CCDV
91/766/CDV PDF file 1129 kB
PDF file 1143 kB
2008-05-022008-04
CCDV
91/766F/CDV PDF file 1143 kB
2008-07-18 
AFDIS
91/878/RVC PDF file 748 kB
2009-08-142009-01
DECFDIS
2009-09-012009-08
RFDIS
2009-09-082009-09
CFDIS
91/897/FDIS

2009-10-162009-12
APUB
91/909/RVD PDF file 248 kB
2010-01-042009-12
BPUB
2010-01-052009-12
PPUB
2010-01-142010-01
  

Abstract

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.

Project

IEC 61191-6:2010 ED1

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method