International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Walter HUCKPPUB2008-072020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/553/MCR PDF file 151 kB
2005-09-01 
1CD
91/554/CD PDF file 280 kB
2005-09-022005-09
CDM
91/602/CC PDF file 191 kB
2006-05-052006-01
ACDV
91/602A/CC PDF file 182 kB
2006-10-272006-07
CCDV
91/640/CDV PDF file 647 kB
2006-10-272006-10
AFDIS
91/693/RVC PDF file 235 kB
2007-06-152007-06
DECFDIS
2008-04-082007-10
RFDIS
2008-04-142008-04
CFDIS
91/764/FDIS
2008-04-252008-07
APUB
91/774/RVD PDF file 127 kB
2008-06-302008-06
BPUB
2008-07-012008-07
PPUB
2008-07-212008-08
 2018-02

Abstract

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.

Project

IEC 60068-2-20:2008 ED5

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

 

 

Associated Documents:

91/1455/RR

PDF file 90 kB