International Standards and Conformity Assessment for all electrical, electronic and related technologies
Electronics assembly technology
|TC 91||WG 3||Kuniaki Takahashi||PPUB||2007-08||2023|
The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
IEC 62137-1-2:2007 ED1
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Merges - IEC 62137-1-2/FRAGF ED1