International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47AWG 7Mr Kee-Won KwonPPUB2018-122024

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47A/961/NP PDF file 304 kB
2015-02-27 
ANW
47A/972/RVN Word file 132 kB
PDF file 136 kB
2015-06-262015-07
ACD
2015-06-272015-06
CD
47A/1021/CD
PDF file 575 kB
2017-06-092017-02
PCC
2017-09-012017-09
ACDV
47A/1031/CC PDF file 157 kB
Word file 104 kB
2017-10-062017-12
TCDV
2017-10-252017-12
CCDV
47A/1036/CDV
PDF file 587 kB
PDF file 406 kB
2017-12-152017-12
PRVC
2018-03-092018-03
AFDIS
47A/1048/RVC PDF file 178 kB
Word file 138 kB
2018-04-272018-07
TFDIS
2018-06-012018-07
DECFDIS
2018-07-092018-07
RFDIS
2018-08-072018-07
CFDIS
47A/1061/FDIS

2018-09-142018-10
PRVD
2018-10-262018-10
APUB
47A/1065/RVD PDF file 150 kB
2018-11-022018-11
BPUB
2018-11-022018-11
PPUB
2018-11-282018-12
  

Project

IEC 63011-2:2018 ED1

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

 

Remark:

Dr. Wonjong Kim is the co-project leader.

 

Associated Documents:

47A/982/RM

PDF file 215 kB
SMB/5970/DL

PDF file 471 kB