International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 MERGED2008-05 

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2008-03-12 
DECPUB
2008-03-12 
RPUB
2008-04-08 
PPUB
2008-05-142008-06
MERGED
2008-05-14 
  

Abstract

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Project

IEC 62137-1-1/FRAGF ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test