International Standards and Conformity Assessment for all electrical, electronic and related technologies
Electronics assembly technology
|TC 91||WG 6||Kunio Takahara||PPUB||2015-03||2022|
IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
IEC TS 62878-2-3:2015 ED1
Device embedded substrate - Part 2-3: Guidelines - Design guide