International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | D.J. SOBER | PPUB | 2009-06 | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-04-06 | ||||
| ANW |
| 2007-08-24 | 2007-08 | |||
| CCDV |
| 2007-08-25 | ||||
| AFDIS |
| 2007-09-28 | 2007-12 | |||
| DECFDIS | 2009-01-22 | 2009-01 | ||||
| RFDIS | 2009-02-02 | 2009-02 | ||||
| CFDIS |
| 2009-02-27 | 2009-04 | |||
| APUB |
| 2009-05-06 | 2009-04 | |||
| BPUB | 2009-05-07 | 2009-05 | ||||
| PPUB | 2009-05-26 | 2009-06 | ||||
Project
IEC 61249-4-17:2009 ED1
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Associated Documents:
SMB/3860/DL
285 kB