International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4Mr Jianwei CaiPPUB2018-012023

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2017-01-25 
PNW
91/1423/NP PDF file 350 kB
2017-01-27 
PRVN
2017-03-242017-03
ACDV
91/1436/RVN Word file 124 kB
PDF file 247 kB
2017-04-072017-09
TCDV
2017-06-222017-09
CCDV
91/1447/CDV
PDF file 334 kB
2017-08-112017-08
PRVC
2017-11-032017-11
APUB
91/1483/RVC PDF file 237 kB
Word file 126 kB
2017-11-102018-02
TPUB
2017-11-272018-02
DECPUB
2017-11-272018-01
RPUB
2017-11-292017-12
BPUB
2017-12-052018-02
PPUB
2018-01-102018-01
  

Project

IEC 61249-2-45:2018 ED1

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly