International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Hiroshi Nishikawa | PPUB | 2016-07 | 2021 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2013-08-28 | ||||
| ANW |
| 2014-01-16 | 2014-01 | |||
| 1CD |
| 2014-11-21 | 2014-07 | |||
| ACDV |
| 2015-03-13 | 2015-03 | |||
| CCDV |
| 2015-08-14 | 2015-11 | |||
| AFDIS |
| 2015-11-27 | 2016-02 | |||
| DECFDIS | 2016-03-28 | 2016-03 | ||||
| RFDIS | 2016-04-21 | 2016-04 | ||||
| CFDIS |
| 2016-05-06 | 2016-06 | |||
| APUB |
| 2016-06-23 | 2016-07 | |||
| BPUB | 2016-06-24 | 2016-07 | ||||
| PPUB | 2016-07-13 | 2016-08 | ||||
313 kB
130 kBProject
IEC 62739-2:2016 ED1
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing