International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | MERGED |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| BPUB | 2004-12-16 | |||
| DECPUB | 2005-01-03 | |||
| RPUB | 2005-01-17 | |||
| PPUB | 2005-02-23 | 2005-02 | ||
| MERGED | 2005-02-23 | |||
Project
IEC 60068-2-58/FRAGF ED3
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)