International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 56

Dependability

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 56WG 2 Valter LOLLPPUB2006-072023

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
56/788/MCR PDF file 53 kB
2002-01-11 
1CD
56/845/CD PDF file 1866 kB
2003-01-172003-01
ACDV
56/908/CC PDF file 109 kB
2003-10-172003-05
CCDV
56/914/CDV PDF file 2200 kB
PDF file 2234 kB
2003-11-212003-10
CDVM
56/957/RVC PDF file 113 kB
2004-05-072004-07
AFDIS
56/957A/RVC Word file 163 kB
PDF file 128 kB
2004-11-192004-09
DECFDIS
2006-01-052005-10
RFDIS
2006-01-112006-01
CFDIS
56/1102/FDIS

2006-03-102006-04
APUB
56/1118/RVD PDF file 253 kB
2006-05-172006-07
BPUB
2006-05-182006-08
PPUB
2006-06-262006-09
  

Abstract

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.

Project

IEC 61163-1:2006 ED2

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

 

 

Associated Documents:

56/1758/RM

PDF file 165 kB
56/1493/RM

PDF file 163 kB
SMB/3130A/DL

PDF file 222 kB