International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 Hirofumi NakajimaPPUB2011-062021

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/752/MCR PDF file 40 kB
2009-08-21 
1CD
47D/763/CD PDF file 405 kB
2010-01-082009-09
ACDV
47D/768/CC Word file 105 kB
PDF file 210 kB
2010-04-302010-05
ACDV
47D/768A/CC Word file 105 kB
PDF file 209 kB
2010-04-302010-05
CCDV
47D/784/CDV PDF file 398 kB
PDF file 381 kB
2010-10-082010-06
APUB
47D/795/RVC Word file 94 kB
PDF file 205 kB
2011-04-012011-06
DECPUB
2011-04-012011-06
BPUB
2011-04-052011-04
RPUB
2011-04-20 
PPUB
2011-06-082011-08
  

Project

IEC 60191-6-12:2011 ED2

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

 

 

Associated Documents:

47D/901A/RM

PDF file 145 kB