International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2 H. NakajimaPPUB 2021

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/126/NP  
1996-07-26 
ANW
47D/173A/RVN  
1996-12-151996-12
1CD
47D/195/CD  
1997-09-191998-12
ACDV
47D/257/CC PDF file 199 kB
1999-01-151998-06
CCDV
47D/313/CDV PDF file 55 kB
1999-07-231999-05
AFDIS
47D/350/RVC PDF file 37 kB
2000-02-112000-03
DECPUB
2000-06-18 
DECFDIS
2000-07-112000-07
ADISSB
2000-07-11 
DECFDIS
2000-11-28 
RFDIS
2000-12-052000-12
CFDIS
47D/404/FDIS
2000-12-222001-03
CFDIS
47D/404A/FDIS
2000-12-222001-03
APUB
47D/421/RVD PDF file 23 kB
2001-02-122001-03
BPUB
2001-02-132001-07
PPUB
2001-03-222001-04
  

Project

IEC 60191-6-6:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

 

 

Associated Documents:

47D/901A/RM

PDF file 145 kB