International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | PPUB | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW | 1987-10-01 | |||||
| ANW | 1987-10-02 | |||||
| 1CD |
| 1994-01-28 | ||||
| 1CD |
| 1994-01-28 | ||||
| CCDV |
| 1994-01-29 | ||||
| CCDV |
| 1994-01-29 | ||||
| AFDIS |
| 1994-08-12 | ||||
| DECFDIS | 1996-03-05 | 1996-02 | ||||
| RFDIS | 1996-04-15 | 1996-04 | ||||
| CFDIS |
| 1996-07-12 | 1996-08 | |||
| APUB |
| 1996-10-06 | 1996-10 | |||
| BPUB | 1996-10-07 | 1996-11 | ||||
| PPUB | 1996-12-19 | 1996-11 | ||||
Project
IEC 62326-4-1:1996 ED1
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
Associated Documents:
52/628/RM