International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 2 | Kaichi Tsuruta | DELPUB | 2007-06 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2004-09-24 | ||||
| 1CD |
| 2005-04-29 | 2004-11 | |||
| CDM |
| 2005-08-26 | 2005-08 | |||
| ACDV |
| 2005-11-11 | 2005-11 | |||
| CCDV |
| 2005-11-25 | 2005-11 | |||
| CDVM |
| 2006-05-12 | 2006-06 | |||
| AFDIS |
| 2006-10-06 | 2006-07 | |||
| DECFDIS | 2006-10-27 | 2006-11 | ||||
| RFDIS | 2006-11-06 | 2006-11 | ||||
| CFDIS |
| 2007-02-02 | 2007-02 | |||
| APUB |
| 2007-04-13 | 2007-05 | |||
| BPUB | 2007-04-16 | 2007-06 | ||||
| PPUB | 2007-04-26 | 2007-07 | ||||
| DELPUB | 2017-12-13 | |||||
| WPUB | ||||||
92 kBProject
IEC 61190-1-3:2007 ED2
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications