International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 M. SuwaPPUB2015-032022

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/962/RR PDF file 40 kB
2011-02-11 
1CD
91/963/CD PDF file 587 kB
2011-02-122011-02
A2CD
91/980/CC PDF file 137 kB
2011-06-172011-06
2CD
91/1016/CD PDF file 412 kB
2011-10-282011-08
A3CD
91/1046/CC Word file 554 kB
PDF file 1003 kB
2012-08-242012-03
3CD
91/1047/CD PDF file 1204 kB
2012-08-242012-08
ACDV
91/1135/CC Word file 178 kB
PDF file 132 kB
2013-08-222012-12
CCDV
91/1136/CDV
PDF file 549 kB
PDF file 472 kB
2013-10-312013-11
AFDIS
91/1199/RVC Word file 246 kB
PDF file 163 kB
2014-07-112014-04
DECFDIS
2014-09-112014-10
RFDIS
2014-09-222014-09
CFDIS
91/1222/FDIS

2014-12-052014-12
APUB
91/1250/RVD PDF file 48 kB
2015-03-022015-02
BPUB
2015-03-032015-02
PPUB
2015-03-272015-03
  

Abstract

IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.

Project

IEC 60068-2-58:2015 ED4

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

 

 

Associated Documents:

SMB/5155/DL

PDF file 207 kB
SMB/5067/DL

PDF file 211 kB
SMB/4881/DL

PDF file 348 kB