TC 119

Printed Electronics

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 119WG 2Mr Byoung-Joon KimPPUB2021-032025

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2017-06-04 
PNW
119/175/NP PDF file 502 kB
2017-06-09 
PRVN
2017-09-012017-09
ACD
119/194/RVN Word file 183 kB
PDF file 219 kB
2017-10-202018-10
CD
119/222/CD
PDF file 584 kB
2018-05-042018-10
PCC
2018-07-272018-07
CDM
119/237/CC PDF file 235 kB
Word file 59 kB
2018-09-142018-10
ACDV
119/237A/CC PDF file 258 kB
Word file 65 kB
2018-12-212019-04
TCDV
2019-04-102019-05
CCDV
119/267/CDV
PDF file 572 kB
2019-05-312019-05
PRVC
2019-08-232019-08
AFDIS
119/287/RVC PDF file 551 kB
Word file 69 kB
2019-10-112019-12
AFDIS
119/287A/RVC PDF file 549 kB
Word file 69 kB
2019-10-112019-12
DECFDIS
2020-11-162021-04
RFDIS
2020-11-172020-12
CFDIS
119/342/FDIS
2020-12-142021-02
PRVD
2021-01-222021-01
APUB
119/345/RVD PDF file 292 kB
2021-02-052021-02
BPUB
2021-02-052021-02
PPUB
2021-03-032021-03
  

Abstract

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

Project

IEC 62899-202-7:2021 ED1

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method