TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Shigeru SUGINOBPUB2021-022025

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1322/RR PDF file 85 kB
2015-11-27 
ACD
2015-11-282015-11
CD
91/1518/CD
PDF file 791 kB
2018-06-222018-07
PCC
91/1599/CC PDF file 268 kB
Word file 206 kB
2018-09-142018-09
ACDV
2019-07-242019-07
TCDV
2019-07-262019-09
CCDV
91/1601/CDV
PDF file 925 kB
PDF file 944 kB
2019-09-132019-09
PRVC
2019-12-072019-12
APUB
91/1674/RVC PDF file 209 kB
Word file 52 kB
2020-10-092020-12
TPUB
2020-10-152020-12
DECPUB
2020-11-132020-12
RPUB
2020-12-032020-12
BPUB
2021-01-062021-02
PPUB
 2021-02


Project

IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

 

Remark:

Target date of 1CD changed to 2017-07 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.
Target date for the next stage after PCC changed from 2018-10 to 2019-08 (91/1536/DL).
Project plan - CDV: 2017-08, FDIS: 2018-06.
Mr Tsuyoshi Yamamoto is the other project leader.

 

Associated Documents:

91/1472/DL

PDF file 587 kB