TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Yoshiharu KariyaACD2022-04 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2018-02-08 
PNW
91/1497/NP PDF file 404 kB
2018-02-09 
PRVN
2018-05-042018-05
ACD
91/1529/RVN Word file 141 kB
PDF file 193 kB
2018-09-142019-12
CD
 2021-12


Project

IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

 

Remark:

Hiroshi Nishikawa is the co-project leader (91/1536/DL).