TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Mr Douglas J SoberCDM2022-04 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2017-10-30 
PNW
91/1480/NP PDF file 495 kB
2017-11-03 
PRVN
2018-01-262018-01
ACD
91/1516/RVN Word file 212 kB
PDF file 204 kB
2018-06-082018-11
CD
91/1546/CD
PDF file 216 kB
2018-11-092018-11
PCC
2019-02-012019-02
CDM
91/1613/CC PDF file 153 kB
Word file 35 kB
2019-09-132019-10
 2021-03


Project

IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

 

Remark:

SMB/6840/DL - CDV: 2020-03.

 

Associated Documents:

SMB/6840/DL

PDF file 291 kB