TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 10 | Mr Douglas J Sober | CDM | 2022-04 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2017-09-19 | |||||
| PNW |
| 2017-09-29 | ||||
| PRVN | 2017-12-22 | 2017-12 | ||||
| ACD |
| 2018-01-12 | 2018-09 | |||
| CD |
| 2018-11-09 | 2018-09 | |||
| PCC | 2019-02-01 | 2019-02 | ||||
| CDM |
| 2019-09-13 | 2019-10 | |||
| 2021-03 | ||||||
132 kBProject
IEC 61189-2-801 ED1
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
Remark:
Target date for next stage after CDM changed to 2021-03 (91/1685/DL).
SMB/7060/DL - CDV: 2020-09.
SMB/6840/DL - CDV: 2020-03.
Associated Documents:
91/1685/DL
764 kBSMB/7060/DL
296 kBSMB/6840/DL
291 kB