International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 1 | WPUB |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1995-03-17 | ||||
| ANW |
| 1995-08-03 | 1995-08 | |||
| ANW |
| 1995-08-03 | 1995-08 | |||
| 1CD |
| 1998-09-25 | 1997-08 | |||
| CCDV |
| 1998-09-25 | ||||
| CDVM |
| 1999-06-04 | 1999-05 | |||
| AFDIS |
| 1999-07-09 | 1999-07 | |||
| ADISSB | 1999-10-14 | |||||
| DECFDIS | 1999-10-26 | |||||
| RPUB | 2000-01-14 | |||||
| RFDIS | 2000-02-28 | 2000-01 | ||||
| CFDIS |
| 2000-03-17 | 2000-03 | |||
| APUB |
| 2000-06-06 | 2000-06 | |||
| BPUB | 2000-06-07 | 2000-07 | ||||
| PPUB | 2000-08-24 | 2000-08 | ||||
| WPUB |
| 2002-08-09 | ||||
Project
IEC 60249-2-11:1987/AMD4:2000 ED1
Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Associated Documents:
52/804/RM
320 kB52/628/RM