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TC 91
Electronics assembly technology
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Project files
>
Project: IEC 62326-14 ED1
Detail
Committee
Working Groups
Project Leader
Current
Status
Frcst Pub
Date
Stability
Date
TC 91
WG 6
Mr. M. Aoki
DEL
2012-12
History
Stage
Document
Downloads
Decision Date
Target Date
PNW
91/894A/NP
1485 kB
2009-10-02
ANW
91/914/RVN
216 kB
2010-02-19
2010-02
DEL
2011-10-07
2011-09
Project
IEC 62326-14 ED1
IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide
Associated Documents:
91/1022/RM
118 kB
SMB/4536/DL
273 kB
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