International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 12 | Mr Hiroyuki ISHIBASHI | ACDV | 2021-12 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| ACD |
| 2019-07-19 | ||||
| CD |
| 2019-08-02 | 2019-12 | |||
| PCC | 2019-09-27 | 2019-09 | ||||
| ACDV |
| 2019-11-08 | 2020-07 | |||
| TCDV | 2020-07 | |||||
Project
IEC 61188-6-2 ED1
Circuit boards and circuit boards assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Remark:
Project title has been changed from “Printed boards and printed boards assemblies“ to “Circuit boards and circuit boards assemblies“ (see 91/1605/RQ, 91/1591/Q).
Associated Documents:
91/1605/RQ
152 kB91/1591/Q
144 kB
21 kB