International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Mr Shigeru SUGINO | PRVC | 2020-10 | 2025 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2015-11-27 | ||||
| ACD | 2015-11-28 | 2015-11 | ||||
| CD |
| 2018-06-22 | 2018-07 | |||
| PCC |
| 2018-09-14 | 2018-09 | |||
| ACDV | 2019-07-24 | 2019-07 | ||||
| TCDV | 2019-07-26 | 2019-09 | ||||
| CCDV |
| 2019-09-13 | 2019-09 | |||
| PRVC | 2019-12-07 | 2019-12 | ||||
| 2020-02 | ||||||
206 kBProject
IEC 61189-5-601 ED1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Remark:
Target date of 1CD changed to 2017-07 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.
Target date for the next stage after PCC changed from 2018-10 to 2019-08 (91/1536/DL).
Project plan - CDV: 2017-08, FDIS: 2018-06.
Mr Tsuyoshi Yamamoto is the other project leader.
Associated Documents:
91/1472/DL
587 kB