International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | WG 6 | Mr Yoshihisa KATOH | PPUB | 2019-10 | 2026 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
---|---|---|---|---|---|---|
PNW |
| 2015-11-27 | ||||
ANW |
| 2016-03-18 | 2016-04 | |||
ACD |
| 2016-03-19 | 2016-03 | |||
CD |
| 2018-07-27 | 2018-01 | |||
PCC | 2018-09-21 | 2018-09 | ||||
ACDV |
| 2018-11-23 | 2019-02 | |||
TCDV | 2019-01-22 | 2019-03 | ||||
CCDV |
| 2019-03-15 | 2019-03 | |||
PRVC |
| 2019-06-07 | 2019-06 | |||
APUB | 2019-07-08 | 2019-07 | ||||
TPUB | 2019-07-15 | |||||
DECPUB | 2019-07-22 | 2019-09 | ||||
RPUB | 2019-08-05 | 2019-08 | ||||
BPUB | 2019-09-02 | 2019-10 | ||||
PPUB | 2019-09-16 | 2019-10 | ||||
Project
IEC 62878-2-5:2019 ED1
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
Associated Documents:
91/1472/DL

