International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 2 | DELPUB |
History
Stage | Document | Downloads | Decision Date | Target Date |
|---|---|---|---|---|
| BPUB | 2010-09-16 | |||
| PPUB | 2010-11-10 | 2010-11 | ||
| DELPUB | 2017-12-13 | |||
| WPUB | ||||
Project
IEC 61190-1-3:2007+AMD1:2010 CSV ED2.1
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications