International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | D.J. SOBER | PPUB | 2012-11 | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-03-07 | ||||
| ANW |
| 2008-08-01 | 2008-07 | |||
| 1CD |
| 2009-10-02 | 2009-06 | |||
| CDM |
| 2010-08-13 | 2010-02 | |||
| ACDV |
| 2010-09-16 | 2011-01 | |||
| CCDV |
| 2010-09-17 | 2010-09 | |||
| AFDIS |
| 2011-08-15 | 2011-05 | |||
| DECFDIS | 2012-06-11 | 2011-09 | ||||
| RFDIS | 2012-06-22 | 2012-06 | ||||
| CFDIS |
| 2012-08-30 | 2012-09 | |||
| APUB |
| 2012-11-05 | 2012-10 | |||
| BPUB | 2012-11-06 | 2012-11 | ||||
| PPUB | 2012-11-29 | 2012-12 | ||||
122 kBProject
IEC 61249-2-40:2012 ED1
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Associated Documents:
SMB/4821/DL
252 kB