International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Michael KRAPP | DELPUB | 2007-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| CDTR |
| 2006-05-05 | ||||
| CDTR |
| 2006-06-02 | ||||
| APUB |
| 2006-10-06 | 2006-10 | |||
| APUB |
| 2006-12-08 | 2006-10 | |||
| DECPUB | 2006-12-08 | 2007-02 | ||||
| BPUB | 2006-12-21 | 2007-01 | ||||
| RFDIS | 2007-01-08 | |||||
| PPUB | 2007-03-12 | 2007-03 | ||||
| DELPUB | 2014-10-17 | |||||
5924 kB
181 kBProject
IEC TR 60068-3-12:2007 ED1
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile