SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | WG 2 | Mr Yutaka Kumano | PNW | 2023-12 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| prePNW | 2021-01-06 | |||||
| PNW |
| 2021-01-22 | ||||
| PRVN | 2021-04 | |||||
646 kBProject
PNW 47D-927 ED1
Future 63xxx-3 Ed.1: Thermal standardization on semiconductor packaging – Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis