SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2Mr Yutaka KumanoPRVN2023-12 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2020-12-16 
PNW
47D/926/NP PDF file 656 kB
2020-12-18 
PRVN
2021-03-122021-03
 2021-04


Project

PNW 47D-926 ED1

Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis