International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Shigeru SUGINOTCDV2020-102025

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1322/RR PDF file 85 kB
2015-11-27 
ACD
2015-11-282015-11
CD
91/1518/CD
PDF file 791 kB
2018-06-222018-07
PCC
91/1599/CC PDF file 268 kB
Word file 206 kB
2018-09-142018-09
ACDV
2019-07-242019-07
TCDV
2019-07-262019-09
CCDV
 2019-09

Project

IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

 

Remark:

Target date of 1CD changed to 2017-07 based on decision taken at TC 91 meeting in Frankfurt, Germany 2016-10-14.
Target date for the next stage after PCC changed from 2018-10 to 2019-08 (91/1536/DL).
Project plan - CDV: 2017-08, FDIS: 2018-06.
Mr Tsuyoshi Yamamoto is the other project leader.

 

Associated Documents:

91/1472/DL

PDF file 587 kB