International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10 DELPUB  

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2006-09-15 
RPUB
2006-09-20 
PPUB
2006-11-272006-11
DELPUB
2007-10-09 
  

Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.

Project

IEC 61189-3:1997+AMD1:1999 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)