International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Kuniaki TakahashiPPUB2007-082023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/456/NP PDF file 265 kB
2004-05-14 
ANW
91/522/RVN PDF file 133 kB
2005-05-062004-09
1CD
91/523/CD PDF file 362 kB
2005-05-062005-05
CDM
91/545/CC PDF file 118 kB
2005-08-262005-09
ACDV
91/545A/CC PDF file 156 kB
2006-01-062005-11
CCDV
91/580/CDV PDF file 306 kB
2006-01-202006-01
CDVM
91/631/RVC Word file 145 kB
PDF file 503 kB
2006-09-222006-09
AFDIS
91/631A/RVC PDF file 223 kB
2007-01-12 
DECFDIS
2007-01-242007-01
RFDIS
2007-02-092007-02
CFDIS
91/683/FDIS
2007-04-272007-05
APUB
91/699/RVD PDF file 101 kB
2007-07-092007-06
BPUB
2007-07-102007-07
PPUB
2007-07-252007-09
  

Abstract

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Project

IEC 62137-1-2:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test