International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1Mr Udo WelzelPPUB2020-072027

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1440/RR PDF file 91 kB
2017-04-10 
CD
91/1534/CD
PDF file 512 kB
2018-10-052018-02
PCC
91/1598/CC PDF file 246 kB
Word file 62 kB
2018-12-282018-12
ACDV
2019-07-242019-07
TCDV
2019-07-262019-09
CCDV
91/1602/CDV PDF file 578 kB

2019-09-132019-09
CCDV
91/1602(F)/CDV PDF file 619 kB
2019-09-132019-09
PRVC
2019-12-062019-12
AFDIS
91/1642/RVC PDF file 199 kB
Word file 46 kB
2020-02-282020-07
DECFDIS
2020-03-162020-07
RFDIS
2020-03-202020-04
CFDIS
91/1648/FDIS
2020-04-242020-06
PRVD
2020-06-052020-06
APUB
91/1653/RVD PDF file 198 kB
2020-06-192020-06
BPUB
2020-06-192020-06
PPUB
2020-07-142020-07
  

Abstract

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

Project

IEC 61760-1:2020 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

 

 

Associated Documents:

SMB/6550/DL

PDF file 444 kB