International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | DELPUB |   |
History
Stage | Document | Downloads | Decision Date | Target Date |
---|---|---|---|---|
PPUB | 1976-01-01 | |||
DELPUB | 1995-11-28 | |||
Project
IEC 60249-3A ED2
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials. Note: Still valid, will be renumbered as 249-3-2 when next revised
