International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 4 | LIU Jun | PPUB | 2010-04 | 2020 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2007-06-15 | ||||
| ANW |
| 2007-11-23 | 2007-10 | |||
| 1CD |
| 2008-02-29 | 2007-11 | |||
| CDM |
| 2008-09-19 | 2008-06 | |||
| ACDV |
| 2009-02-27 | 2008-11 | |||
| CCDV |
| 2009-03-06 | 2009-02 | |||
| CCDV |
| 2009-05-01 | ||||
| AFDIS |
| 2009-10-02 | 2009-11 | |||
| DECFDIS | 2009-11-16 | 2010-02 | ||||
| RFDIS | 2009-11-25 | 2009-12 | ||||
| CFDIS |
| 2010-01-22 | 2010-02 | |||
| APUB |
| 2010-03-29 | 2010-03 | |||
| BPUB | 2010-03-30 | 2010-04 | ||||
| PPUB | 2010-04-21 | 2010-05 | ||||
296 kBProject
IEC 61249-2-42:2010 ED1
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly