International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Hiroshi OHSHIMA | DELPUB | 2006-05 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2002-06-14 | ||||
| 1CD |
| 2003-03-14 | 2002-11 | |||
| ACDV |
| 2003-10-31 | 2003-07 | |||
| ACDV |
| 2004-02-27 | ||||
| CCDV |
| 2004-03-12 | 2004-03 | |||
| AFDIS |
| 2004-09-24 | 2004-11 | |||
| DECFDIS | 2005-09-21 | 2004-12 | ||||
| RFDIS | 2005-09-29 | 2005-10 | ||||
| CFDIS |
| 2006-01-13 | 2005-12 | |||
| APUB |
| 2006-03-21 | 2006-03 | |||
| BPUB | 2006-03-22 | 2006-04 | ||||
| PPUB | 2006-04-27 | 2006-05 | ||||
| DELPUB | 2017-03-07 | |||||
| WPUB | ||||||
87 kBProject
IEC 60068-2-54:2006 ED2
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method