TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Kaichi TsurutaTPUB2021-062026

History

Stage
Document
Downloads
Decision Date
Target Date
PWI
2019-04-04 
prePNW
2019-05-232019-07
PNW
91/1581/NP PDF file 869 kB
2019-05-242019-06
PRVN
2019-08-162019-08
ACD
91/1609/RVN Word file 43 kB
PDF file 234 kB
2019-09-062019-12
CD
91/1620/CD
PDF file 1569 kB
2019-11-082019-12
PCC
2020-01-312020-01
ACDV
91/1654/CC PDF file 221 kB
Word file 136 kB
2020-06-192020-08
TCDV
2020-06-232020-08
CCDV
91/1655/CDV PDF file 1626 kB

PDF file 1276 kB
2020-08-142020-08
PRVC
2020-11-062020-11
APUB
91/1698/RVC PDF file 457 kB
Word file 968 kB
2020-12-182021-04
TPUB
2021-01-042021-04
DECPUB
 2021-02


Project

IEC 61189-5-301 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

 

Remark:

This is a joint project between WG 2 and WG 3.