TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Walter HuckCFDIS2021-042026

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1455/RR PDF file 90 kB
2017-07-25 
CD
91/1587/CD
PDF file 295 kB
2019-07-122018-12
PCC
2019-10-042019-10
ACDV
91/1625/CC PDF file 164 kB
Word file 42 kB
2019-11-152020-02
TCDV
2020-04-272020-06
CCDV
91/1650/CDV
PDF file 362 kB
PDF file 306 kB
2020-06-192020-06
PRVC
2020-09-112020-09
AFDIS
91/1686/RVC PDF file 274 kB
Word file 41 kB
2020-11-282021-02
DECFDIS
2020-12-092021-02
RFDIS
2020-12-102020-12
CFDIS
91/1701/FDIS PDF file 408 kB
2021-01-082021-03
PRVD
 2021-02

Abstract

IEC 60068-2-20 ED6 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58.
This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering.
This edition includes the following significant technical changes with respect to the previous edition:

  1. update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.

Project

IEC 60068-2-20 ED6

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

 

Remark:

SMB/6550/DL - CDV: 2019-09-30
CD target date changed from 2018-02 to 2018-12 (91/1536/DL).

 

Associated Documents:

SMB/6550/DL

PDF file 444 kB