International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | WG 3 | Tsuyoshi Yamamoto | PPUB | 2014-10 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2011-11-22 | ||||
| 1CD |
| 2012-09-07 | 2012-06 | |||
| ACDV |
| 2013-02-06 | 2013-02 | |||
| CCDV |
| 2013-05-15 | 2013-05 | |||
| AFDIS |
| 2013-11-07 | 2013-11 | |||
| DECFDIS | 2014-03-31 | 2014-02 | ||||
| RFDIS | 2014-04-08 | 2014-04 | ||||
| CFDIS |
| 2014-06-20 | 2014-06 | |||
| APUB |
| 2014-09-18 | 2014-08 | |||
| BPUB | 2014-09-19 | 2014-09 | ||||
| PPUB | 2014-10-09 | 2014-10 | ||||
178 kBProject
IEC 62137-4:2014 ED1
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Associated Documents:
112/164/RM
291 kB