Button back to homepage

International

Electrotechnical

Commission

International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology
 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Hiroshi OSHIMA, Masashi AokiPPUB2011-092023

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/532/NP PDF file 524 kB
2005-06-24 
ANW
91/584/RVN PDF file 167 kB
2006-03-172005-11
1CD
91/682/CD PDF file 647 kB
2007-04-202006-09
CDM
91/725/CC PDF file 46 kB
2007-09-212007-08
A2CD
91/725A/CC PDF file 274 kB
2008-12-052008-03
2CD
91/846/CD PDF file 528 kB
2009-01-302008-11
ACDV
91/875/CC PDF file 847 kB
2009-06-262009-06
CCDV
91/903/CDV PDF file 717 kB
PDF file 791 kB
2009-11-202009-09
AFDIS
91/944/RVC Word file 291 kB
PDF file 278 kB
2010-09-102010-07
DECFDIS
2011-04-142011-05
RFDIS
2011-04-192011-04
CFDIS
91/975/FDIS

2011-06-032011-07
APUB
91/992/RVD PDF file 73 kB
2011-08-152011-08
BPUB
2011-08-162011-08
PPUB
2011-09-072011-09
  

Project

IEC 60068-2-83:2011 ED1

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

 

 

Associated Documents:

SMB/3860/DL

PDF file 285 kB

 
    • Privacy | Contact | IEC offices
    Copyright © IEC . All rights reserved.