TC 91

Electronics assembly technology

Detail

Committee	Working Groups	Project Leader	Current Status	Frcst Pub Date	Stability Date
TC 91	WG 3	Hiroshi OSHIMA, Masashi Aoki	PPUB	2011-09	2023

History

Stage

Document

Downloads

Decision Date

Target Date

PNW

91/532/NP

524 kB

2005-06-24

ANW

91/584/RVN

167 kB

2006-03-17

2005-11

1CD

91/682/CD

647 kB

2007-04-20

2006-09

CDM

91/725/CC

46 kB

2007-09-21

2007-08

A2CD

91/725A/CC

274 kB

2008-12-05

2008-03

2CD

91/846/CD

528 kB

2009-01-30

2008-11

ACDV

91/875/CC

847 kB

2009-06-26

2009-06

CCDV

91/903/CDV

717 kB

791 kB

2009-11-20

2009-09

AFDIS

91/944/RVC

291 kB

278 kB

2010-09-10

2010-07

DECFDIS

2011-04-14

2011-05

RFDIS

2011-04-19

2011-04

CFDIS

91/975/FDIS

2011-06-03

2011-07

APUB

91/992/RVD

73 kB

2011-08-15

2011-08

BPUB

2011-08-16

2011-08

PPUB

2011-09-07

2011-09

Abstract

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Project

IEC 60068-2-83:2011 ED1

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Associated Documents:

SMB/3860/DL

285 kB

International

Electrotechnical

Commission