International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Detail
Committee | Working Groups | Project Leader | Current Status |
Frcst Pub Date | Stability Date |
---|---|---|---|---|---|
TC 91 | WG 3 | Hiroshi OSHIMA, Masashi Aoki | PPUB | 2011-09 | 2023 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
---|---|---|---|---|---|---|
PNW |
| 2005-06-24 | ||||
ANW |
| 2006-03-17 | 2005-11 | |||
1CD |
| 2007-04-20 | 2006-09 | |||
CDM |
| 2007-09-21 | 2007-08 | |||
A2CD |
| 2008-12-05 | 2008-03 | |||
2CD |
| 2009-01-30 | 2008-11 | |||
ACDV |
| 2009-06-26 | 2009-06 | |||
CCDV |
| 2009-11-20 | 2009-09 | |||
AFDIS |
| 2010-09-10 | 2010-07 | |||
DECFDIS | 2011-04-14 | 2011-05 | ||||
RFDIS | 2011-04-19 | 2011-04 | ||||
CFDIS |
| 2011-06-03 | 2011-07 | |||
APUB |
| 2011-08-15 | 2011-08 | |||
BPUB | 2011-08-16 | 2011-08 | ||||
PPUB | 2011-09-07 | 2011-09 | ||||
Project
IEC 60068-2-83:2011 ED1
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Associated Documents:
SMB/3860/DL

