International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Ms yuan gaoACD2022-01 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2019-07-17 
PNW
91/1593/NP PDF file 300 kB
2019-07-19 
PRVN
2019-10-112019-10
ACD
91/1633/RVN Word file 39 kB
PDF file 207 kB
2019-12-202020-01
CD
 2020-01

Project

IEC 61189-2-807 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA