SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG 2Mr Yutaka KumanoPRVDTR2021-122026

History

Stage
Document
Downloads
Decision Date
Target Date
PWI
2021-02-12 
preDTR
2021-02-15 
TDTR
2021-02-17 
CDTR
47D/928/DTR
2021-02-262021-04
PRVDTR
2021-04-232021-04
 2021-07


Project

IEC TR 63378-1 ED1

Thermal standardization on semiconductor packages – Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

 

 

Associated Documents:

47D/924A/INF

PDF file 211 kB
47D/920/DC

PDF file 1276 kB