International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 6Mr Yoshihisa KATOHPPUB2019-102026

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/1321/NP PDF file 2111 kB
2015-11-27 
ANW
91/1352/RVN Word file 119 kB
PDF file 142 kB
2016-03-182016-04
ACD
91/1352A/RVN Word file 40 kB
PDF file 184 kB
2016-03-192016-03
CD
91/1522/CD
PDF file 1749 kB
2018-07-272018-01
PCC
2018-09-212018-09
ACDV
91/1549/CC PDF file 133 kB
Word file 99 kB
2018-11-232019-02
TCDV
2019-01-222019-03
CCDV
91/1557/CDV
PDF file 1814 kB
PDF file 1867 kB
2019-03-152019-03
PRVC
91/1589/RVC PDF file 165 kB
Word file 36 kB
2019-06-072019-06
APUB
2019-07-082019-07
TPUB
2019-07-15 
DECPUB
2019-07-222019-09
RPUB
2019-08-052019-08
BPUB
2019-09-022019-10
PPUB
2019-09-162019-10
  

Abstract

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Project

IEC 62878-2-5:2019 ED1

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

 

 

Associated Documents:

91/1472/DL

PDF file 587 kB