International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Tsuyoshi YAMAMOTOACD2021-12 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2018-02-08 
PNW
91/1497/NP PDF file 404 kB
2018-02-09 
PRVN
2018-05-042018-05
ACD
91/1529/RVN Word file 141 kB
PDF file 193 kB
2018-09-142019-12
CD
 2020-08

Project

IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

 

Remark:

Hiroshi Nishikawa is the co-project leader (91/1536/DL).